US Patent Issued to Winbond Electronics on July 28 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,440, issued on July 28, was assigned to Winbond Electronics Corp. (Taichung City, Taiwan).

"Semiconductor structure and method of manufacturing the same" was invented by Tzu-Hsun Huang (Chiayi City, Taiwan) and Yi-Hao Chien (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, several buried word lines in the substrate, a dielectric material layer on the substrate, a semiconductor material layer on the dielectric material layer, and several contacts disposed on the substrate. The substrate includes several active regions and isolation structures that surround the active regions. The con...