US Patent Issued to WINBOND ELECTRONICS on July 28 for "Semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,441, issued on July 28, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan).

"Semiconductor structure" was invented by Kai Jen (Taichung City, Taiwan) and Hsiang-Po Liu (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, an insulating layer formed on the substrate, and a plurality of pairs of linear structures arranged in parallel and formed in the insulating layer, wherein each pair of linear structures has a first linear structure and a second linear structure. There is a first space S1 between an end portion of the first linear structure and an end portion of the seco...