ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,436, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor interconnection s... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,437, issued on July 21, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Semiconductor fabrication method with improve... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,438, issued on July 21, was assigned to Celestial AI Inc. (Santa Clara, Calif.). "Via formed in a wafer using a front-side and a back-side ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,439, issued on July 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Semiconductor structure for reducing RLC pa... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,440, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Three-dimensional integrated ci... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,441, issued on July 21, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,442, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Replacement via and buried or backside power rail" was invented... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,443, issued on July 21, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Self-aligned backside contact with increased... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,444, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Inline circuit edit for backside power delivery" was invented b... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,445, issued on July 21, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Semiconductor device including backside sign... Read More