US Patent Issued to International Business Machines on July 21 for "Semiconductor device including backside signal wiring and frontside power supply" (New York Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,445, issued on July 21, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Semiconductor device including backside signal wiring and frontside power supply" was invented by Ruilong Xie (Niskayuna, N.Y.), Chanro Park (Clifton Park, N.Y.), Juntao Li (Cohoes, N.Y.), Min Gyu Sung (Latham, N.Y.) and Julien Frougier (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided including frontside interconnects (i.e., metal wires) used mainly as power supplies and backside interconnects (i.e., metal wires) used mainly as signal wiring. The semiconductor device includes a frontside back-end-of-the-line (...