US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Semiconductor interconnection structures and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,436, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor interconnection structures and methods of forming the same" was invented by Cheng-Chin Lee (Hsinchu, Taiwan), Ting-Ya Lo (Hsinchu, Taiwan), Hsiao-Kang Chang (Hsinchu, Taiwan), Hsin-Yen Huang (Hsinchu, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnection structure is provided. The interconnection structure includes an etching-process-free first dielectric layer, a first conductive structure extending within the first dielectric layer, a second dielectric layer formed under th...