US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Three-dimensional integrated circuit with hybrid bond metal structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,440, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Three-dimensional integrated circuit with hybrid bond metal structure" was invented by Jui Shen Chang (Taichung City, Taiwan), Yu-Chang Lai (Hsinchu City, Taiwan), Chen-Nan Chiu (Hsinchu City, Taiwan), Yao-Chun Chuang (Hsinchu City, Taiwan) and Jun He (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect of the present disclosure pertains to an IC packaging structure that includes a bottom circuit structure having first semiconductor devices on a first substrate, a first interconnect structure over the first semicon...