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ATHENS-CLARKE COUNTY GOVERNMENT Issues Solicitation Notice ‘BID #26046 Middle Oconee East Trunk Sanitary Sewer Improvements Phase 1A’

Atlanta, July 21 -- ATHENS-CLARKE COUNTY GOVERNMENT has issued a solicitation notice (PE-62960-NONST-2027-000000121) titled ‘BID #26046 Middle Oconee East Trunk Sanitary Sewer Improvements Phase 1A’. ... Read More


DEMOREST, CITY OF Issues Solicitation Notice ‘Demorest City Hall Parking Lot’

Atlanta, July 21 -- DEMOREST, CITY OF has issued a solicitation notice (PE-66890-NONST-2026-000000003) titled ‘Demorest City Hall Parking Lot’. Notably, the event starts on July 20 and ends on Aug. 24... Read More


MORGAN COUNTY BOARD OF COMMISSIONERS Issues Solicitation Notice ‘Morgan County Former Jail Demolition and Site Restoration’

Atlanta, July 21 -- MORGAN COUNTY BOARD OF COMMISSIONERS has issued a solicitation notice (PE-77426-NONST-2027-000000030) titled ‘Morgan County Former Jail Demolition and Site Restoration’. Notably, t... Read More


US Patent Issued to Samsung Electronics, SEMES on July 21 for "Substrate bonding apparatus" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,482, issued on July 21, was assigned to Samsung Electronics Co. Ltd (Suwon-si, South Korea) and SEMES Co. LTD. (Cheonan-si, South Korea). "... Read More


US Patent Issued to Intel on July 21 for "Semiconductor chip package having internal I/O structures with modulated thickness to compensate for die/substrate warpage" (Arizona Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,483, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor chip package having internal I/O structures with ... Read More


US Patent Issued to NANYA TECHNOLOGY on July 21 for "Bonding pad structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,484, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Bonding pad structure and method for manufacturi... Read More


US Patent Issued to TOWA on July 21 for "Semiconductor device manufacturing method and lead frame" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,485, issued on July 21, was assigned to TOWA Corp. (Kyoto, Japan). "Semiconductor device manufacturing method and lead frame" was invented ... Read More


US Patent Issued to Infineon Technologies on July 21 for "Subtractive metal structuring on surface of semiconductor package" (Malaysian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,486, issued on July 21, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Subtractive metal structuring on surface of semicon... Read More


US Patent Issued to Microsoft Technology Licensing on July 21 for "Embedding an electronic component in a core of an integrated circuit substrate" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,487, issued on July 21, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Embedding an electronic component in a core o... Read More


US Patent Issued to Adeia Semiconductor Bonding Technologies on July 21 for "Cavity packages" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,488, issued on July 21, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Cavity packages" was invented by... Read More