US Patent Issued to Infineon Technologies on July 21 for "Subtractive metal structuring on surface of semiconductor package" (Malaysian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,486, issued on July 21, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Subtractive metal structuring on surface of semiconductor package" was invented by Pei Luan Pok (Melaka, Malaysia), Swee Kah Lee (Melaka, Malaysia), Soon Lock Goh (Malacca, Malaysia), Chee Hong Lee (Paya Rumput, Malaysia), Samsun Paing (Tangkak, Malaysia) and Chee Chiew Chong (Batu Caves, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor package includes providing a baseplate, mounting a semiconductor die on the baseplate with a main surface of the semiconductor die facing away from the baseplate, forming vertical interco...