US Patent Issued to Intel on July 21 for "Semiconductor chip package having internal I/O structures with modulated thickness to compensate for die/substrate warpage" (Arizona Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,483, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor chip package having internal I/O structures with modulated thickness to compensate for die/substrate warpage" was invented by Onur Ozkan (Scottsdale, Ariz.), Edvin Cetegen (Chandler, Ariz.), Steve Cho (Chandler, Ariz.), Nicholas S. Haehn (Scottsdale, Ariz.) and Jacob Vehonsky (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes I/O structures having pads and solder balls to couple with a semiconductor chip, wherein, a first subset of pads and/or solder balls of the pads and solder balls that approach t...