ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,487, issued on July 21, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.).
"Embedding an electronic component in a core of an integrated circuit substrate" was invented by Jon Thomas Woodyard (Livermore, Calif.) and Rahul Agarwal (Livermore, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Examples are provided that relate to embedding, in a core of a substrate, an electronic component having a thickness less than a thickness of the core. One example provides an electronic device comprising a substrate comprising a core and one or more buildup layers coupled with the core, each buildup layer comprising a metal layer and a diel...