US Patent Issued to TOWA on July 21 for "Semiconductor device manufacturing method and lead frame" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,485, issued on July 21, was assigned to TOWA Corp. (Kyoto, Japan).

"Semiconductor device manufacturing method and lead frame" was invented by Syuho Hanasaka (Kyoto, Japan), Naomi Fujiwara (Kyoto, Japan), Yudai Takamori (Kyoto, Japan), Yoshito Nakamura (Kyoto, Japan), Kanji Ishibashi (Kyoto, Japan) and Saori Isono (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lead frame has a back surface having a multiple-irradiated region that is irradiated with laser light scanned in a first scan step and laser light scanned in a second scan step, a unit resin molded product that is formed in a cutting step has corner regions overlapping the multi...