US Patent Issued to NXP USA on July 14 for "Integrated circuit with dielectric layer having selectively implanted stress-setting dopants" (Texas, Oregon Inventors)

Posted On: 2026-07-14

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,172, issued on July 14, was assigned to NXP USA Inc. (Austin, Texas). "Integrated circuit with dielectric layer having selectively implante... Read More

US Patent Issued to SILICONWARE PRECISION INDUSTRIES on July 14 for "Electronic package and shielding part including semiconductor block and magnetized layer" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,173, issued on July 14, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung, Taiwan). "Electronic package and shielding par... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "RFSOI semiconductor structures including an electromagnetic shield layer and methods of manufacturing the same" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,174, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "RFSOI semiconductor structures incl... Read More

US Patent Issued to Teledyne e2v Semiconductors on July 14 for "Flip-chip ball grid array-type integrated circuit package for very high frequency operation" (French Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,175, issued on July 14, was assigned to Teledyne e2v Semiconductors SAS (Saint Egreve, France). "Flip-chip ball grid array-type integrated ... Read More

US Patent Issued to MURATA MANUFACTURING on July 14 for "Radio-frequency module and communication device" (Japanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,176, issued on July 14, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Radio-frequency module and communication device... Read More

US Patent Issued to DB HiTek on July 14 for "RF switch device and method of manufacturing same" (South Korean Inventor)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,177, issued on July 14, was assigned to DB HiTek Co. Ltd. (Bucheon-si, South Korea). "RF switch device and method of manufacturing same" wa... Read More

US Patent Issued to Semiconductor Manufacturing International (Beijing), Semiconductor Manufacturing International (Shanghai) on July 14 for "Semiconductor structure comprising sub-alignment marks" (Chinese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,178, issued on July 14, was assigned to Semiconductor Manufacturing International (Beijing) Corp. (Beijing) and Semiconductor Manufacturing ... Read More

US Patent Issued to Infineon Technologies Austria on July 14 for "Semiconductor package and method for marking a semiconductor package" (Malaysian Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,179, issued on July 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor package and method for marking ... Read More

US Patent Issued to LAPIS TECHNOLOGY on July 14 for "Semiconductor device and manufacturing method of semiconductor device" (Japanese Inventor)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,180, issued on July 14, was assigned to LAPIS TECHNOLOGY Co. LTD. (Yokohama, Japan). "Semiconductor device and manufacturing method of semi... Read More

US Patent Issued to MITSUBISHI ELECTRIC on July 14 for "Method and device for making integrated cooling liquid cavity in printed circuit board" (French Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,181, issued on July 14, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Method and device for making integrated cooling liquid cavity i... Read More

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US Patent Issued to NXP USA on July 14 for "Integrated circuit with dielectric layer having selectively implanted stress-setting dopants" (Texas, Oregon Inventors)

US Patent Issued to SILICONWARE PRECISION INDUSTRIES on July 14 for "Electronic package and shielding part including semiconductor block and magnetized layer" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "RFSOI semiconductor structures including an electromagnetic shield layer and methods of manufacturing the same" (Taiwanese Inventors)

US Patent Issued to Teledyne e2v Semiconductors on July 14 for "Flip-chip ball grid array-type integrated circuit package for very high frequency operation" (French Inventors)

US Patent Issued to MURATA MANUFACTURING on July 14 for "Radio-frequency module and communication device" (Japanese Inventors)

US Patent Issued to DB HiTek on July 14 for "RF switch device and method of manufacturing same" (South Korean Inventor)

US Patent Issued to Semiconductor Manufacturing International (Beijing), Semiconductor Manufacturing International (Shanghai) on July 14 for "Semiconductor structure comprising sub-alignment marks" (Chinese Inventors)

US Patent Issued to Infineon Technologies Austria on July 14 for "Semiconductor package and method for marking a semiconductor package" (Malaysian Inventors)

US Patent Issued to LAPIS TECHNOLOGY on July 14 for "Semiconductor device and manufacturing method of semiconductor device" (Japanese Inventor)

US Patent Issued to MITSUBISHI ELECTRIC on July 14 for "Method and device for making integrated cooling liquid cavity in printed circuit board" (French Inventors)