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US Patent Issued to Intel on July 14 for "Metal PCB for topside power delivery" (Arizona, Colorado, California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,218, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Metal PCB for topside power delivery" was invented by Kyle Arri... Read More


US Patent Issued to QUALCOMM on July 14 for "Package comprising a chiplet located between an integrated device and a metallization portion" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,219, issued on July 14, was assigned to QUALCOMM Inc. (San Diego). "Package comprising a chiplet located between an integrated device and a... Read More


US Patent Issued to Micron Technology on July 14 for "Modular systems in packages, and associated devices, systems, and methods" (Singaporean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,220, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Modular systems in packages, and associated devices, system... Read More


US Patent Issued to Samsung Display on July 14 for "Display device with offset lower electrodes of different lengths" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,221, issued on July 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device with offset lower electrodes of ... Read More


US Patent Issued to Intel on July 14 for "Package architecture with memory chips having different process regions" (Oregon, Arizona, California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,222, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package architecture with memory chips having different process... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package and manufacturing method thereof" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,223, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and manufacturing meth... Read More


US Patent Issued to Amkor Technology Singapore Holding on July 14 for "Electronic devices and methods of manufacturing electronic devices" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,224, issued on July 14, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... Read More


US Patent Issued to Kioxia on July 14 for "Semiconductor device and manufacturing method of the same" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,225, issued on July 14, was assigned to Kioxia Corp. (Tokyo). "Semiconductor device and manufacturing method of the same" was invented by T... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor packages" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,226, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packages" was invented by Hyoe... Read More


US Patent Issued to Sharp Display Technology on July 14 for "Active matrix device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,227, issued on July 14, was assigned to Sharp Display Technology Corp. (Kameyama City, Japan). "Active matrix device" was invented by Kohhe... Read More