US Patent Issued to Kioxia on July 14 for "Semiconductor device and manufacturing method of the same" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,225, issued on July 14, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor device and manufacturing method of the same" was invented by Takeori Maeda (Mie Mie, Japan) and Soichi Homma (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one or more embodiments, a semiconductor device includes a support having a recess. A plurality of semiconductor chips are stacked on each other in the recess. A plurality of columnar electrodes in the recess extend from the semiconductor chips toward an opening of the support. A wiring layer is disposed over the opening. The recess is filled with an insulating material to cover the sem...