ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,485, issued on Sept. 1, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan). "Method for forming alignment keys of semiconducto... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,486, issued on Sept. 1, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China). "Wafer matching design method, wa... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,487, issued on Sept. 1, was assigned to NXP USA Inc. (Austin, Texas). "Package with solder mask" was invented by Aznita Abdul Aziz (Puchong... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,488, issued on Sept. 1, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device" was invented by Masato Numazaki (Tokyo), ... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,489, issued on Sept. 1, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor devices including a premolded leadfra... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,490, issued on Sept. 1, was assigned to Intel Corp. (Santa Clara, Calif.). "Fine bump pitch die to die tiling incorporating an inverted gla... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,491, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and met... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,492, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Hyeon... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,493, issued on Sept. 1, was assigned to Wolfspeed Inc. (Durham, N.C.). "Power package having connected components and processes implementin... Read More
ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,494, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package including interposer" ... Read More