US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 1 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,491, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Wei-An Tsao (Yuanlin Township, Taiwan), Chen Yu Wu (Taoyuan City, Taiwan), Po-Han Wang (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan) and Hung-Jui Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments include a method for forming an integrated circuit package. A first dielectric layer is deposited over a wafer, the first dielectric layer overlapping a package region and a scribe line region of the wafer. A first metallization pattern is formed...