US Patent Issued to Wolfspeed on Sept. 1 for "Power package having connected components and processes implementing the same" (Malaysian, American Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,493, issued on Sept. 1, was assigned to Wolfspeed Inc. (Durham, N.C.).

"Power package having connected components and processes implementing the same" was invented by Alexander Komposch (Morgan Hill, Calif.), Liew Soon Lee (Ipoh, Malaysia) and Eng Wah Woo (Ipoh, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a metal submount; at least one transistor die arranged on said metal submount; and one or more metal contacts configured to be located adjacent said metal submount by a connection. The connection is configured as one of the following: a spot welded portion, a laser beam modified portion, a laser beam wel...