US Patent Issued to NXP USA on Sept. 1 for "Package with solder mask" (Malaysian Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,487, issued on Sept. 1, was assigned to NXP USA Inc. (Austin, Texas).

"Package with solder mask" was invented by Aznita Abdul Aziz (Puchong, Malaysia) and Nor Azhan Bin Mahmood (Selangor, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device package may include a solder mask that is positioned to mitigate leakage of resin or other adhesive material from the region of a die and die bond pad onto other surfaces of the package, such as surfaces of wire bond pads. One or more wire bond pads of the package may be formed from the same conductive layer as the die bond pad, and the solder mask may be positioned over a portions of the ...