US Patent Issued to Renesas Electronics on Sept. 1 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,488, issued on Sept. 1, was assigned to Renesas Electronics Corp. (Tokyo).

"Semiconductor device" was invented by Masato Numazaki (Tokyo), Youichi Abe (Tokyo) and Tatsuaki Tsukuda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a die pad having an upper surface; a semiconductor chip; a plurality of leads; and a plurality of wires. The upper surface includes: a first region in which the semiconductor chip is mounted; a second region surrounding the first region in plan view; and a third region surrounding the second region in plan view. Also, a first metal film is provided in the second region. Further, a second...