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US Patent Issued to NITTO DENKO on May 19 for "Resin composition for sealing optical semiconductor, resin molded product for sealing optical semiconductor, optical semiconductor sealing material, and optical semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,707, issued on May 19, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Resin composition for sealing optical semiconductor, resin molded ... Read More


US Patent Issued to TORAY INDUSTRIES on May 19 for "Epoxy resin composition, prepreg, and fiber-reinforced composite material" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,708, issued on May 19, was assigned to TORAY INDUSTRIES Inc. (Tokyo). "Epoxy resin composition, prepreg, and fiber-reinforced composite mate... Read More


US Patent Issued to LG CHEM on May 19 for "Composite resin composition for automotive interior materials and automotive interior material including the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,709, issued on May 19, was assigned to LG CHEM Ltd. (Seoul, South Korea). "Composite resin composition for automotive interior materials and... Read More


US Patent Issued to THE BOARD OF REGENTS OF THE UNIVERSITY OF OKLAHOMA on May 19 for "1,5-pentanediol-based polyester compositions with enhanced crystallization rates and methods of manufacture" (Oklahoma Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,710, issued on May 19, was assigned to THE BOARD OF REGENTS OF THE UNIVERSITY OF OKLAHOMA (Norman, Okla.). "1,5-pentanediol-based polyester ... Read More


US Patent Issued to SHPP Global Technologies on May 19 for "Thermoplastic compositions including blends of polyether ether ketone and polyetherimide" (New York, Indiana Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,712, issued on May 19, was assigned to SHPP Global Technologies B.V. (Bergen op Zoom, Netherlands). "Thermoplastic compositions including bl... Read More


US Patent Issued to Jiangsu Changneng Energy-saving New Materials Science & Technology on May 19 for "Anti-condensation composition, anti-condensation liquid cooling plate, preparation method and application thereof" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,713, issued on May 19, was assigned to Jiangsu Changneng Energy-saving New Materials Science & Technology Co. LTD. (Jiangsu, China). "Anti-c... Read More


US Patent Issued to Lotte Chemical on May 19 for "Thermoplastic resin composition and molded product using same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,714, issued on May 19, was assigned to Lotte Chemical Corp. (Seoul, South Korea). "Thermoplastic resin composition and molded product using ... Read More


US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on May 19 for "Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,715, issued on May 19, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan). "Resin composition, prepreg, film... Read More


US Patent Issued to ARKEMA FRANCE on May 19 for "Formulation comprising carnauba wax and at least one particular sorbitan monoester" (Dutch Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,716, issued on May 19, was assigned to ARKEMA FRANCE (Colombes, France). "Formulation comprising carnauba wax and at least one particular so... Read More


US Patent Issued to UPM-KYMMENE on May 19 for "Wood-derived lignin composition" (Finnish, German Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,717, issued on May 19, was assigned to UPM-KYMMENE Corp. (Helsinki). "Wood-derived lignin composition" was invented by Juha Tamper (Levanen,... Read More