ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,714, issued on May 19, was assigned to Lotte Chemical Corp. (Seoul, South Korea).

"Thermoplastic resin composition and molded product using same" was invented by Yun Seok Bae (Uiwang-si, South Korea), Hyun Je Lee (Uiwang-si, South Korea), Kyun Ha Ban (Uiwang-si, South Korea) and Young Sub Jin (Uiwang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a thermoplastic resin composition and a molded product using same, the thermoplastic resin composition comprising (F) 0.2-3 parts by weight of a polyamide-based flow enhancer on the basis of 100 parts by weight of a basic composition, which comprises: (A) 40-6...