US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on May 19 for "Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,715, issued on May 19, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board" was invented by Jun Yasumoto (Fukushima, Japan), Rihoko Watanabe (Osaka, Japan), Teppei Washio (Fukushima, Japan) and Hiroharu Inoue (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than s...