US Patent Issued to NITTO DENKO on May 19 for "Resin composition for sealing optical semiconductor, resin molded product for sealing optical semiconductor, optical semiconductor sealing material, and optical semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,707, issued on May 19, was assigned to NITTO DENKO Corp. (Osaka, Japan).

"Resin composition for sealing optical semiconductor, resin molded product for sealing optical semiconductor, optical semiconductor sealing material, and optical semiconductor device" was invented by Jun Ikeda (Ibaraki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a resin composition for sealing an optical semiconductor providing both UV transmission and heat resistance, and a molded resin product for sealing an optical semiconductor, an optical semiconductor-sealing material, and an optical semiconductor device each including the same. The resin composition...