ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,438, issued on Sept. 8, was assigned to Daifuku Co. Ltd. (Osaka, Japan). "Article elevating device" was invented by Hiroshi Otsuka (Hinocho... और पढ़ें
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,439, issued on Sept. 8, was assigned to SEMES Co. Ltd. (Cheonan-si, South Korea). "Apparatus for treating substrate and method for treating... और पढ़ें
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,440, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "System and method for automated waf... और पढ़ें
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,441, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate transfer method" was invented by Nanako Shinoda (Yamanashi,... और पढ़ें
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,442, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo). "Process system, method, and substrate chuck" was invented by Matthew ... और पढ़ें
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,443, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Electrostatic clamp having charge control assembly" ... और पढ़ें
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,444, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Electrostatic chuck" was invented by Junh... और पढ़ें
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,445, issued on Sept. 8, was assigned to Beijing E-Town Semiconductor Technology Co. Ltd. (Beijing) and Mattson Technology Inc. (Fremont, Cal... और पढ़ें
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,446, issued on Sept. 8, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Cathode assembly for integration of embedded electro... और पढ़ें
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,447, issued on Sept. 8, was assigned to PVA TePla Analytical Systems GmbH (Westhausen, Germany). "Wafer chuck having multiple simultaneousl... और पढ़ें