Publication

Byline

Location

US Patent Issued to Intel on April 7 for "Quasi-monolithic integrated packaging architecture with mid-die serializer/deserializer" (California, Oregon, Massachusetts, Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,033, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Quasi-monolithic integrated packaging architecture with mid-die... और पढ़ें


US Patent Issued to Intel on April 7 for "Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposer" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,034, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic structure including active base substrate with ... और पढ़ें


US Patent Issued to Samsung Display on April 7 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,035, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Jin Taek Park (... और पढ़ें


US Patent Issued to Arm on April 7 for "Circuit architecture in multi-dimensional monolithic structure" (Indian, French Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,036, issued on April 7, was assigned to Arm Ltd. (Cambridge, Great Britain). "Circuit architecture in multi-dimensional monolithic structur... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,037, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Song-... और पढ़ें


US Patent Issued to Samsung Display on April 7 for "Display device with a heat dissipation substrate and a cover substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,038, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device with a heat dissipation substrat... और पढ़ें


US Patent Issued to SHENZHEN JUFEI OPTOELECTRONICS on April 7 for "LED chip module and method for manufacturing LED chip module" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,039, issued on April 7, was assigned to SHENZHEN JUFEI OPTOELECTRONICS Co. LTD (Shenzhen, China). "LED chip module and method for manufactu... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Three-dimensional integrated circuit structure and a method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,040, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional integrated circuit structu... और पढ़ें


US Patent Issued to Innolux on April 7 for "Communication device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,041, issued on April 7, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Communication device and manufacturing method thereof" was ... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Carrier structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,042, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Carrier structure and methods of fo... और पढ़ें