US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Carrier structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,042, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Carrier structure and methods of forming the same" was invented by Zheng Yong Liang (Kaohsiung, Taiwan), Wei-Ting Yeh (Hsinchu, Taiwan), Jyh-Cherng Sheu (Hsinchu, Taiwan), Yu-Yun Peng (Hsinchu, Taiwan) and Keng-Chu Lin (Ping-Tung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A carrier structure and methods of forming and using the same are described. In some embodiments, the method includes forming one or more devices over a substrate, forming a first interconnect structure over the one or more devices, and bonding the first interconnect ...