ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,013, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor packages for stacked memory-on-package (SMOP) and... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,014, issued on April 7, was assigned to POWERTECH TECHNOLOGY INC. (Hsinchu County, Taiwan). "Package device and manufacturing method thereo... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,015, issued on April 7, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Power module for vehicl... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,016, issued on April 7, was assigned to Dell Products LP (Round Rock, Texas). "Flip chip package" was invented by Qinghong He (Austin, Texa... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,017, issued on April 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Package substrate" was invented by Nam Heon Kim (Seoul, ... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,018, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure with enhancement ... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,019, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China). "Embedded packaging structure and manufact... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,020, issued on April 7, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Electronic component bonding machines, a... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,021, issued on April 7, was assigned to Altera Corp. (San Jose, Calif.). "Homogenous die stacking with increased element density" was inven... और पढ़ें
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,022, issued on April 7, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore). "Apparatus for applying a sintering force via a compressible... और पढ़ें