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US Patent Issued to Tokyo Electron on Oct. 6 for "Plasma processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,939, issued on Oct. 6, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus" was invented by Masaki Hirayama (Fuchu Cit... Read More


US Patent Issued to Tokyo Electron on Oct. 6 for "Plasma processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,940, issued on Oct. 6, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus" was invented by Mitsutoshi Ashida (Yamanas... Read More


US Patent Issued to Tokyo Electron on Oct. 6 for "Modification method and modification device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,941, issued on Oct. 6, was assigned to Tokyo Electron Ltd. (Tokyo). "Modification method and modification device" was invented by Takafumi N... Read More


US Patent Issued to SAMSUNG ELECTRONICS, New Power Plasma on Oct. 6 for "Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,942, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and New Power Plasma Co. LTD. (Pyeongtaek-si, Sou... Read More


US Patent Issued to Applied Materials on Oct. 6 for "External cooling assembly for substrate support" (California, Texas Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,943, issued on Oct. 6, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "External cooling assembly for substrate support" was i... Read More


US Patent Issued to Applied Materials on Oct. 6 for "Electrostatically secured substrate support assembly" (California Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,944, issued on Oct. 6, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Electrostatically secured substrate support assembly" ... Read More


US Patent Issued to Hitachi High-Tech on Oct. 6 for "Plasma processing apparatus and gas exhaust method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,945, issued on Oct. 6, was assigned to Hitachi High-Tech Corp. (Tokyo). "Plasma processing apparatus and gas exhaust method" was invented by... Read More


US Patent Issued to KIOXIA on Oct. 6 for "Semiconductor manufacturing apparatus and semiconductor device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,946, issued on Oct. 6, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor manufacturing apparatus and semiconductor device manufacturing m... Read More


US Patent Issued to Thermo Fisher Scientific (Bremen) on Oct. 6 for "Method for determining a measure of a rate of decay and mass spectrometry system" (German Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,948, issued on Oct. 6, was assigned to Thermo Fisher Scientific (Bremen) GmbH (Bremen, Germany). "Method for determining a measure of a rate... Read More


US Patent Issued to SHIMADZU on Oct. 6 for "Ion analysis using image-charge/current analysis" (British Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,949, issued on Oct. 6, was assigned to SHIMADZU Corp. (Kyoto, Japan). "Ion analysis using image-charge/current analysis" was invented by Ale... Read More