ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,943, issued on Oct. 6, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"External cooling assembly for substrate support" was invented by Dinkesh Huderi Somanna (San Jose, Calif.) and Dan Deyo (Austin, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of cooling assemblies for substrate supports are provided herein. In some embodiments, a cooling assembly for a substrate support includes a pedestal having a substrate supporting surface and a backside opposite the substrate supporting surface; and a cooling assembly coupled to the pedestal and configured to provide cooling gas to the backside of the pedestal, wherein the co...