US Patent Issued to KIOXIA on Oct. 6 for "Semiconductor manufacturing apparatus and semiconductor device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,755,946, issued on Oct. 6, was assigned to KIOXIA Corp. (Tokyo).

"Semiconductor manufacturing apparatus and semiconductor device manufacturing method" was invented by Shohei Arakawa (Mie Mie, Japan) and Yuta Osada (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing apparatus includes: a chamber including a top plate; a holder provided in the chamber and configured to place a substrate; a high-frequency power source configured to apply high-frequency power to the holder; a gas supply pipe configured to supply a gas to the chamber; a gas discharge pipe configured to discharge a gas from the chamber; and a plur...