ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,765, issued on Oct. 6, was assigned to SERIPHY TECHNOLOGY Corp. (Hsinchu County, Taiwan). "Semiconductor packages, semiconductor device and ... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,766, issued on Oct. 6, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Eiji Kuwahara (Kyoto, Japan), To... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,767, issued on Oct. 6, was assigned to INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES (Guangzhou, China). "Chiplet-fine-intercon... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,768, issued on Oct. 6, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo). "Semiconductor module" was invented by Yuji Morin... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,769, issued on Oct. 6, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo). "Semiconductor module" was invented by Yuji Morin... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,771, issued on Oct. 6, was assigned to AT & S Austria Technologie & Systemtechnik AG (Leoben, Austria). "IC substrate with support structure... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,772, issued on Oct. 6, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China). "Composite substrate, manufacturing method thereof, and se... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,773, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure including a package... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,774, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "Silicon nitride layer under a copper pad" was invented by Brandon... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,775, issued on Oct. 6, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board and semiconductor package comprising same" w... Read More