US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Package structure including a package substrate and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,773, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure including a package substrate and methods of forming the same" was invented by Chia-Jen Cheng (Banciao City, Taiwan), Kuo-Ching Hsu (Taipei, Taiwan) and Mirng-Ji Lii (Sinpu Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate includes a dielectric layer structure including a first dielectric layer and a second dielectric layer, a plurality of bonding pads located at a lower surface of the first dielectric layer, a plurality of metal pillars located on an upper surface of the second dielectric layer, a...