US Patent Issued to SHINDENGEN ELECTRIC MANUFACTURING on Oct. 6 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,768, issued on Oct. 6, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo).

"Semiconductor module" was invented by Yuji Morinaga (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor module including four semiconductor chips, first and second power terminals, and first and second intermediate points, a bridge circuit is formed. The first power terminal and second power terminal are disposed adjacently to each other, the first intermediate point and second intermediate point are disposed adjacently to each other. At a time of using the semiconductor module, currents flow in opposite directions with respect to...