US Patent Issued to ENKRIS SEMICONDUCTOR on Oct. 6 for "Composite substrate, manufacturing method thereof, and semiconductor device" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,772, issued on Oct. 6, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China).

"Composite substrate, manufacturing method thereof, and semiconductor device" was invented by Kai Cheng (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a composite substrate, a manufacturing method thereof and a semiconductor device. The composite substrate includes a first substrate, a bonding layer, and a second substrate which are stacked sequentially, where the first substrate comprises a plurality of protruding structures disposed on a side close to the second substrate, and a groove formed between at least two protruding structures of t...