US Patent Issued to AT & S Austria Technologie & Systemtechnik on Oct. 6 for "IC substrate with support structure and functional inlays therein" (Austrian Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,771, issued on Oct. 6, was assigned to AT & S Austria Technologie & Systemtechnik AG (Leoben, Austria).

"IC substrate with support structure and functional inlays therein" was invented by Gerald Weis (Bruck an der Mur, Austria), Stefano Sergio Oggioni (Leoben, Austria), Markus Leitgeb (Trofaiach, Austria) and Marco Gavagnin (Leoben, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit substrate for surface mounting an integrated circuit component thereon, wherein the integrated circuit substrate comprises a support structure having at least one hole, and at least two functional inlays placed inside said at least one hole side ...