ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,745, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Junghoo... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,746, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Wire bonding using in-situ plasma tre... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,747, issued on Oct. 6. "Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheet" was invented ... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,748, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "Aligned via and trace formation using multi-tone phoitomasks and ... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,749, issued on Oct. 6, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China). "Packaging structure having organic interpos... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,750, issued on Oct. 6, was assigned to DUKSAN HI METAL Co. LTD. (Ulsan, South Korea). "Metal pillar for conductive connection" was invented ... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,751, issued on Oct. 6, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Semiconductor package assembly with electric field modulation... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,752, issued on Oct. 6, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device with reverse and observe surfaces" was invented b... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,753, issued on Oct. 6, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Electronic device with high draft angle package structure" was inve... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,754, issued on Oct. 6, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor module" was invented by Hirotoshi Kusama (Kariya-cit... Read More