US Patent Issued on Oct. 6 for "Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheet" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,747, issued on Oct. 6.

"Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheet" was invented by Masaya Toba (Minato-ku, Japan), Kazuyuki Mitsukura (Minato-ku, Japan) and Masaki Yamaguchi (Minato-ku, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a wiring board includes preparing a structure body in which a resin sheet having a glass cloth arranged in an organic resin is attached onto a support body having a metal layer provided on a surface thereof or onto a built-in wiring layer provided on the support body, forming a recess by excimer laser in a first resin layer region...