US Patent Issued to Nexperia on Oct. 6 for "Semiconductor package assembly with electric field modulation structures" (German Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,751, issued on Oct. 6, was assigned to Nexperia B.V. (Nijmegen, Netherlands).

"Semiconductor package assembly with electric field modulation structures" was invented by Tim Bottcher (Hamburg, Germany), Hans-Juergen Funke (Hamburg, Germany) and Ivan Shiu (Hamburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package assembly and molding resin case is provided. The package includes a lead frame having a first and a second lead frame side opposite to the first; a semiconductor die structure having a first and a second die side opposite to the first, the die structure being mounted with its second die side on the first lead fram...