US Patent Issued to Intel on Oct. 6 for "Aligned via and trace formation using multi-tone phoitomasks and multi-layer photosensitive stacks" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,748, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"Aligned via and trace formation using multi-tone phoitomasks and multi-layer photosensitive stacks" was invented by Changhua Liu (Chandler, Ariz.), Leonel R. Arana (Phoenix), Jeremy D. Ecton (Gilbert, Ariz.), Suddhasattwa Nad (Chandler, Ariz.) and Brandon Christian Marin (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques for low- or zero-misaligned vias are disclosed. In one embodiment, a high-photosensitivity layer, a medium-photosensitivity layer, and a low-photosensitivity layer are applied to a substrate and exposed at the same time with use of a mul...