ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,745, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Junghoon Kang (Suwon-si, South Korea), Seungwan Shin (Suwon-si, South Korea) and Jung Hyun Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a first redistribution substrate including a first redistribution insulating layer and a first redistribution via, a first insulating layer on the first redistribution substrate, a solder pad on the first insulating layer, a first alignment key penetrating the first insulating layer and extending to an inside of ...