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US Patent Issued to International Business Machines on Oct. 6 for "Through layer skip via" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,713, issued on Oct. 6, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Through layer skip via" was invented by Nichol... Read More


US Patent Issued to ABLIC on Oct. 6 for "Capacitive element and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,714, issued on Oct. 6, was assigned to ABLIC Inc. (Nagano, Japan). "Capacitive element and semiconductor device" was invented by Mitsuhiro Y... Read More


US Patent Issued to International Business Machines on Oct. 6 for "Method and structure for forming landing for backside power distribution network" (New York Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,715, issued on Oct. 6, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Method and structure for forming landing for b... Read More


US Patent Issued to International Business Machines on Oct. 6 for "Single backside power plane for improved power delivery" (New York Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,716, issued on Oct. 6, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Single backside power plane for improved power... Read More


US Patent Issued to International Business Machines on Oct. 6 for "Vertical-transport field-effect transistors with shared backside power supply" (New Hampshire, New York, Vermont Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,717, issued on Oct. 6, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Vertical-transport field-effect transistors wi... Read More


US Patent Issued to International Business Machines on Oct. 6 for "Power gating transistor for BSPDN" (New York Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,718, issued on Oct. 6, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Power gating transistor for BSPDN" was invente... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor device having a through contact connected to a buried pattern and penetrating a field insulation film and an etch stop layer" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,719, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a through contact ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor device and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,720, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and electronic system inc... Read More


US Patent Issued to UNITED MICROELECTRONICS on Oct. 6 for "Barrier layers for interconnects in bonded wafers" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,721, issued on Oct. 6, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Barrier layers for interconnects in bonded wa... Read More


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on Oct. 6 for "Memory and fabrication method thereof and memory system" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,722, issued on Oct. 6, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Memory and fabrication method thereof and memor... Read More