ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,715, issued on Oct. 6, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Method and structure for forming landing for backside power distribution network" was invented by Ruilong Xie (Niskayuna, N.Y.), Alexander Reznicek (Troy, N.Y.), Somnath Ghosh (Clifton Park, N.Y.) and Kisik Choi (Watervliet, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor including a first sacrificial layer located directly between a first substrate layer and a second substrate layer, where the first sacrificial layer has a first thickness. The second substrate layer has a second thickness and where the second thickness is larger than the...