US Patent Issued to International Business Machines on Oct. 6 for "Through layer skip via" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,713, issued on Oct. 6, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Through layer skip via" was invented by Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Ruilong Xie (Niskayuna, N.Y.), Albert M. Chu (Nashua, N.H.), Reinaldo Vega (Mahopac, N.Y.), Lawrence Alfred Clevenger (Saratoga Springs, N.Y.) and Brent A. Anderson (Jericho, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a through layer skip via that traverses an intermediary metal layer. The through layer skip via has a damascene metal portion and a subtractive metal portion. A dielectric spacer is disposed within a thickness of the in...