ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,560, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Joo... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,561, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method for fabricating a semiconductor dev... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,562, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Methods of forming bonding st... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,563, issued on April 21, was assigned to Monolithic 3D Inc. (Allen, Texas). "3D semiconductor devices and structures with functional units... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,564, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Treatment of electrodes of MIM ca... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,565, issued on April 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Three-dimensional interlocked corrugated capacitor structures... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,566, issued on April 21, was assigned to Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai). "Semiconductor structure a... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,567, issued on April 21, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Electrical device for high-voltage applicatio... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,568, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with electrode having ste... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,569, issued on April 21, was assigned to Fast SiC Semiconductor Inc. (Hsinchu City, Taiwan). "Silicon carbide semiconductor device for pin... Read More