US Patent Issued to NANYA TECHNOLOGY on April 14 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,717, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of manufact... Read More

US Patent Issued to NANYA TECHNOLOGY on April 14 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,717, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of manufact... Read More

US Patent Issued to SK hynix on April 14 for "Memory device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,718, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Memory device and method of manufacturing the same" was ... Read More

US Patent Issued to SK hynix on April 14 for "Memory device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,718, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Memory device and method of manufacturing the same" was ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor device having a through-via structure electrically connected to a contact structure" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,719, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a through-via ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor device having a through-via structure electrically connected to a contact structure" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,719, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a through-via ... Read More

US Patent Issued to Intel on April 14 for "Through mold interconnect drill feature" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,720, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Through mold interconnect drill feature" was invented by Robe... Read More

US Patent Issued to Intel on April 14 for "Through mold interconnect drill feature" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,720, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Through mold interconnect drill feature" was invented by Robe... Read More

US Patent Issued to NVIDIA on April 14 for "Reverse embedded power structure for graphical processing unit chips and system-on-chip device packages" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,721, issued on April 14, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Reverse embedded power structure for graphical processing un... Read More

US Patent Issued to NVIDIA on April 14 for "Reverse embedded power structure for graphical processing unit chips and system-on-chip device packages" (California Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,721, issued on April 14, was assigned to NVIDIA Corp. (Santa Clara, Calif.). "Reverse embedded power structure for graphical processing un... Read More

• ««
• «
• 9617
• 9618
• 9619
• 9620
• 9621
• 9622
• 9623
• 9624
• 9625
• 9626
• »
• »»