US Patent Issued to Intel on April 14 for "Through mold interconnect drill feature" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,720, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Through mold interconnect drill feature" was invented by Robert M. Nickerson (Chandler, Ariz.), Rees Winters (Glendale, Ariz.) and Purushotham Kaushik Muthur Srinath (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through t...