US Patent Issued to GUDENG PRECISION INDUSTRIAL on June 30 for "Supporting structure and inspection equipment therefof and calibrating tool for inspection equipment" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,512, issued on June 30, was assigned to GUDENG PRECISION INDUSTRIAL Co. LTD. (New Taipei City, Taiwan). "Supporting structure and inspectio... Read More

US Patent Issued on June 30 for "Method of compensating die shift in the compression molding" (Singaporean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,513, issued on June 30. "Method of compensating die shift in the compression molding" was invented by Hwee Seng Chew (Singapore). Accordin... Read More

US Patent Issued to Applied Materials on June 30 for "Integrated substrate measurement system" (American, Indian Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,514, issued on June 30, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Integrated substrate measurement system" was invente... Read More

US Patent Issued to DISCO on June 30 for "Method of manufacturing laminated device chips including a dividing step after a cutting step" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,516, issued on June 30, was assigned to DISCO Corp. (Tokyo). "Method of manufacturing laminated device chips including a dividing step afte... Read More

US Patent Issued on June 30 for "Method for producing semiconductor device, and expandable tape" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,517, issued on June 30. "Method for producing semiconductor device, and expandable tape" was invented by Motoo Aoyama (Tokyo) and Masataka ... Read More

US Patent Issued to SCREEN Holdings on June 30 for "Heat treatment susceptor and heat treatment apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,518, issued on June 30, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Heat treatment susceptor and heat treatment apparatus" wa... Read More

US Patent Issued to CHENG MEI INSTRUMENT TECHNOLOGY on June 30 for "Mechanism for fine adjusting an angle of a semiconductor wafer fixture" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,519, issued on June 30, was assigned to CHENG MEI INSTRUMENT TECHNOLOGY Co. LTD. (Zhubei City, Taiwan). "Mechanism for fine adjusting an an... Read More

US Patent Issued to Applied Materials on June 30 for "Substrate warpage reduction" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,520, issued on June 30, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Substrate warpage reduction" was invented by Jooho L... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Method of fabricating a semiconductor device based on a measured misalignment value" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,521, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method of fabricating a semiconductor device... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 30 for "Semiconductor device and method of testing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,522, issued on June 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and method... Read More

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