US Patent Issued to DISCO on June 30 for "Method of manufacturing laminated device chips including a dividing step after a cutting step" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,516, issued on June 30, was assigned to DISCO Corp. (Tokyo).

"Method of manufacturing laminated device chips including a dividing step after a cutting step" was invented by Zhiwen Chen (Tokyo) and Nobuyasu Kitahara (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing laminated device chips includes affixing a support substrate to a face side of a first device wafer, processing the first device wafer from a reverse side thereof to thin down the first device wafer to a predetermined thickness, forming cut grooves in the first device wafer thereby to cut the first device wafer, affixing the first device wafer to a second devi...