ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,513, issued on June 30.
"Method of compensating die shift in the compression molding" was invented by Hwee Seng Chew (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to methods for compensating for die shift during compression molding of semiconductor dies. The method includes using a compensated marked carrier which includes a plurality of physical carrier markings derived from original projected markings. These original projected markings are generated through projection of original virtual carrier markings, based on a green file, and are transformed by applying a compensation factor in a computing apparatu...