US Patent Issued to Applied Materials on June 2 for "Showerhead assembly with heated showerhead" (Indian, American Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,183, issued on June 2, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Showerhead assembly with heated showerhead" was invent... Read More

US Patent Issued to Applied Materials on June 2 for "Tunable hardware to control radial flow distribution in a processing chamber" (California Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,184, issued on June 2, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Tunable hardware to control radial flow distribution i... Read More

US Patent Issued to Destination 2D on June 2 for "Low-temperature/BEOL-compatible highly scalable graphene synthesis tool" (British, American Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,185, issued on June 2, was assigned to Destination 2D Inc. (San Jose, Calif.). "Low-temperature/BEOL-compatible highly scalable graphene syn... Read More

US Patent Issued to Tokyo Electron on June 2 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,186, issued on June 2, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and substrate processing method" was inv... Read More

US Patent Issued to Xerox on June 2 for "Metallized polymer particles and related methods" (Canadian Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,187, issued on June 2, was assigned to Xerox Corp. (Norwalk, Conn.). "Metallized polymer particles and related methods" was invented by Nan-... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 2 for "Method of fabricating semiconductor device using apparatus for supplying supercritical fluids" (South Korean Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,188, issued on June 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of fabricating semiconductor device usi... Read More

US Patent Issued to HOHAI UNIVERSITY on June 2 for "Anti-cavitation damping composite metal structure for flow passage component" (Chinese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,189, issued on June 2, was assigned to HOHAI UNIVERSITY (Nanjing, China). "Anti-cavitation damping composite metal structure for flow passag... Read More

US Patent Issued to Ohio State Innovation Foundation on June 2 for "Materials and methods for the electrochemical reduction of carbon dioxide" (Ohio, Oregon, Delaware Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,190, issued on June 2, was assigned to Ohio State Innovation Foundation (Columbus, Ohio). "Materials and methods for the electrochemical red... Read More

US Patent Issued to Panasonic Intellectual Property Management on June 2 for "Electrochemical hydrogen pump" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,191, issued on June 2, was assigned to Panasonic Intellectual Property Management Co. Ltd. (Osaka, Japan). "Electrochemical hydrogen pump" w... Read More

US Patent Issued to City University of Hong Kong on June 2 for "Catalyst for solar-driven electrocatalytic overall water splitting and methods of making and using thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,192, issued on June 2, was assigned to City University of Hong Kong (Hong Kong, Hong Kong). "Catalyst for solar-driven electrocatalytic over... Read More

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